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CHIPS for America Announces Funding Opportunity to Expand U.S. Semiconductor Packaging
CHIPS for America Announces Funding Opportunity to Expand U.S. Semiconductor Packaging ASowah@doc.gov Tue, 02/27/2024 - 21:11 FOR IMMEDIATE RELEASE Wednesday, February 28, 2024 Office of Public Affairs publicaffairs@doc.gov

Today, the U.S. Department of Commerce issued a Notice of Funding Opportunity (NOFO) to seek applications for research and development (R&D) activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors. The CHIPS for America program anticipates approximately $300 million in funding innovation across multiple technologies ranging from semiconductor-based to glass and organics. This is the third NOFO released overall by CHIPS for America, and the first that is focused on R&D.

President Biden signed the bipartisan CHIPS and Science Act into law on August 9, 2022. The Department of Commerce is overseeing $50 billion to revitalize the U.S. semiconductor industry and strengthen the country’s economic and national security. CHIPS for America R&D within the U.S. Department of Commerce is responsible for administering $11 billion to advance U.S. leadership in semiconductor R&D. CHIPS R&D is a critical part of President Biden’s agenda to support American innovation for decades to come.

Emerging applications like artificial intelligence, advanced telecommunications, biomedical devices, and autonomous vehicles require leap-ahead advances in microelectronics capabilities. Improving all aspects of system performance to support the breadth of new semiconductor applications will require advanced packaging. The path to advanced packaging starts with substrates, which are the foundations on which systems are built. More capable substrates open the door to innovation at every other level in the packaging process.

“CHIPS for America is delivering on its vision to make sure new leading-edge chip architectures can be invented in our research labs, designed for every end-use application, manufactured at scale, and packaged with the most advanced technologies. Within a decade, research and activities funded by this advanced packaging program, coupled with CHIPS manufacturing incentives, will establish a vibrant, self-sustaining, and resilient onshore packaging industry, helping ensure our country is a leader in advanced semiconductor manufacturing,” said U.S. Secretary of Commerce Gina Raimondo.

“Materials and substrates are foundational to achieving the necessary advances in advanced packaging to ensure U.S. leadership in the global semiconductor ecosystem,” said Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio. “With this funding opportunity, we are taking the first step toward strengthening domestic advanced packaging approaches so that semiconductor manufacturers can access a full suite of U.S.-based manufacturing capabilities to bring their most innovative solutions to market.”

Funded activities are expected to include, but not necessarily be limited to, basic and applied research, substrate and demonstration device development and production, commercial viability and domestic manufacturing, integrated workforce education and training, and pilot-level substrate production.

CHIPS for America will provide a briefing on details of the NOFO on March 1, 2024, at 3 pm ET. Webinar participants must register in advance.

On March 12, 2024, CHIPS for America’s NAPMP Program will host a one-day meeting for potential applicants for this funding opportunity. For more information and to register for this event, please visit chips.gov.

About CHIPS for America   

CHIPS for America is part of President Biden’s economic plan to invest in America, stimulate private sector investment, create good-paying jobs, make more in the United States, and revitalize communities left behind. CHIPS for America includes the CHIPS Program Office, responsible for manufacturing incentives, and the CHIPS Research and Development (R&D) Office, responsible for R&D programs. Both offices sit within the National Institute of Standards and Technology (NIST) at the Department of Commerce. NIST promotes U.S. innovation and industrial competitiveness by advancing measurement science, standards, and technology in ways that enhance economic security and improve our quality of life. NIST is uniquely positioned to successfully administer the CHIPS for America program because of the bureau’s strong relationships with U.S. industries, its deep understanding of the semiconductor ecosystem, and its reputation as fair and trusted. Visit https://www.chips.gov to learn more.    

Tags CHIPS for America

  U.S. Department of Commerce

 23 hours 40 minutes ago

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Readout of Secretary Raimondo’s Meeting with Minister of Trade, Industry and Energy of the Republic of Korea Ahn Duk-geun
Readout of Secretary Raimondo’s Meeting with Minister of Trade, Industry and Energy of the Republic of Korea Ahn Duk-geun ASowah@doc.gov Tue, 02/27/2024 - 17:20 Export and investment promotion FOR IMMEDIATE RELEASE Tuesday, February 27, 2024 Office of Public Affairs publicaffairs@doc.gov

On Monday evening, U.S. Secretary of Commerce Gina Raimondo spoke with Minister of Trade, Industry, and Energy of the Republic of Korea Ahn Duk-geun. Secretary Raimondo congratulated Minister Ahn on his recent appointment as Minister and noted that she looks forward to working with him in his new role. The two also discussed planning efforts for the first U.S.-Japan-Republic of Korea Trilateral Commerce/Industry Ministerial Meeting as a follow-up to the historic Trilateral Leaders’ Summit between President Biden, Prime Minister Kishida, and President Yoon at Camp David. The Secretary and Minister also discussed the progress made on the Indo-Pacific Economic Framework for Prosperity (IPEF) since the IPEF Ministerial meeting in San Francisco in November 2023 and reaffirmed their commitment to work together and with the other IPEF partners to operationalize the IPEF Supply Chain, Clean Economy, and Fair Economy agreements to deliver concrete benefits to IPEF partners’ economies.

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  U.S. Department of Commerce

 1 day 3 hours ago

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ICYMI: Secretary Raimondo Delivers Update on CHIPS and Science Act Implementation, Lays Road Ahead for Supercharging Innovation and Revitalizing American Semiconductor Manufacturing 
ICYMI: Secretary Raimondo Delivers Update on CHIPS and Science Act Implementation, Lays Road Ahead for Supercharging Innovation and Revitalizing American Semiconductor Manufacturing  ASowah@doc.gov Tue, 02/27/2024 - 13:13 FOR IMMEDIATE RELEASE Tuesday, February 27, 2024 Office of Public Affairs publicaffairs@doc.gov

This week, U.S. Secretary of Commerce Gina Raimondo delivered a major policy address at the Center for Strategic and International Studies (CSIS) on the implementation of President Biden’s CHIPS and Science Act and the leading-edge technology investments by the Department of Commerce to boost innovation and revitalize American semiconductor manufacturing.

President Biden signed the bipartisan CHIPS and Science Act into law to advance U.S. economic and national security, strengthen U.S. supply chains, and create good-paying jobs across the country. Secretary Raimondo’s speech comes as the Biden-Harris Administration continues to roll out the implementation phase of this historic legislation and sets priorities for award recipients to have their facilities operational by the end of the decade to meet the goals of the program.

Watch Secretary Raimondo’s remarks here and read the full transcript here.

In case you missed it, here’s what people across the country are reading: 

THE NEW YORK TIMES: CHIPMAKERS SEEK MORE THAN $70 BILLION IN FEDERAL SUBSIDIES  

Gina Raimondo, the commerce secretary, said new investments would put the U.S. on track to produce roughly 20% of the world’s most advanced logic chips by the end of the decade. Companies that produce the most advanced semiconductors have requested more than $70 billion in federal subsidies, roughly twice the amount of funding that is available, Commerce Secretary Gina Raimondo said on Monday.  

ABC NEWS: TO LEAD ON AI, US NEEDS TO LEAD ON COMPUTER CHIPS, COMMERCE SECRETARY SAYS  

Artificial Intelligence will be the "defining technology of our generation," when it comes to the future of technology, but specifically the advancement of semiconductors in the United States, Commerce Secretary Gina Raimondo said Monday. "You can't lead on AI if you don't believe in making leading-edge chips," Raimondo said in remarks at the Center for Strategic and International Studies. "And so our work in implementing chips have just got a whole lot more important." The Commerce Department is tasked with implementing the CHIPS and Science Act -- which spends nearly $53 billion to spur research in and development of America's semiconductor industry. It is intended to address a nearly two-year global chip shortage that stemmed from supply chain issues related to the COVID-19 pandemic.  

CNBC NEWS: COMMERCE SECRETARY RAIMONDO: U.S. SET TO BECOME A MAJOR HUB OF LEADING-EDGE LOGIC CHIP MANUFACTURING  

The Biden administration is aiming to make the U.S. a major manufacturer of state-of-the-art semiconductor chips before 2030 to compete on the global market, increase national security and create more jobs, Commerce Secretary Gina Raimondo said Monday. “Our investments in leading-edge logic chip manufacturing will put this country on track to produce roughly 20% of the world’s leading-edge logic chips by the end of the decade,” Raimondo said during a speech at the Center for Strategic and International Studies. “That’s a big deal,” she added. “Why is that a big deal? Because folks, today we’re at zero.” The announcement comes a year after the U.S. Department of Commerce opened funding applications for the 2022 CHIPS and Science Act, including $39 billion in manufacturing incentives, and Raimondo outlined its goals by 2030.  

BLOOMBERG: ADVANCED CHIP FIRMS WANT $70 BILLION FROM US, RAIMONDO SAYS  

Advanced semiconductor companies have requested more than double the amount of available federal funds for projects in the US, Commerce Secretary Gina Raimondo said, referring to a program designed to bring chip manufacturing back to American soil. Leading-edge firms — which include Intel Corp., Taiwan Semiconductor Manufacturing Co. and Samsung Electronics Co. — are seeking more than $70 billion from the 2022 Chips Act, Raimondo said Monday in remarks at the Center for Strategic and International Studies in Washington. The legislation set aside $39 billion in grants — plus loans and loan guarantees valued at $75 billion — to revitalize US semiconductor manufacturing after decades of production abroad.  

REUTERS: CHIPS COMPANIES WILL BE LUCKY TO GET HALF OF SUBSIDIES SOUGHT, US COMMERCE SECRETARY SAYS  

U.S. Commerce Secretary Gina Raimondo said Monday chips companies seeking government subsidies from a $52.7 billion program are expected get significantly less than they sought. Raimondo said she is pushing chips companies "to do more for less" in order to fund more projects. She said her conversations with chips company CEOs typically include them asking for billions in government assistance, which she says is reasonable. "I tell them you will be lucky to get half of that." When they come in to finalize a deal, "where they get less than half of what they wanted and they tell me they are not feeling lucky. That's the reality." Raimondo said the department is prioritizing projects that will be operational by 2030.  

POLITICO: RAIMONDO: CHIPS AWARDEES MUST COME ONLINE BY 2030  

Commerce Secretary Gina Raimondo said Monday that her department’s CHIPS office will exclude chipmakers from incentive funds if their fabs cannot come online by 2030. “We want to maximize our impact in this decade,” Raimondo said at an event at the Center for Strategic and International Studies. “It’s not responsible to give money to a project that will come online 10 or 12 years from now if it means saying no to excellent projects that could come online this year.” The requirement places new pressure on microchip manufacturers after several of them have announced delays and pushed back their initial timelines. Why it matters: Last year, Raimondo laid out several goals for the CHIPS Act, including establishing at least two new large-scale clusters of fabs in the U.S. for leading-edge logic chips by 2030.  

YAHOO: BIDEN WANTS THE US TO MAKE 20% OF ALL HIGH-END CHIPS BY END OF THE DECADE  

The Biden administration laid out an ambitious new goal for the US: produce 20% of the world’s most advanced semiconductor chips by the end of the decade. Achieving that mark — set by Commerce Secretary Gina Raimondo in a speech Monday morning — would be a dramatic turnabout for the US. It currently makes 0% of the so-called leading edge logic chips that are considerably more powerful than older-generation semiconductors, making them crucial for everything from mobile phones to AI to quantum computing. "That's a big number, yes," Raimondo said of the 20% goal while speaking at the Center for Strategic and International Studies.  

AGENCE FRANCE-PRESSE: US CAN HOUSE 'ENTIRE' SUPPLY CHAIN FOR ADVANCED CHIPS: COMMERCE DEPT  

US Commerce Secretary Gina Raimondo expressed confidence Monday that the country can house the entire silicon supply chain for making advanced chips, including tech that is key for artificial intelligence. Her comments come as the United States looks to cement its lead in the chip industry -- especially for chips needed for the development of AI -- both on national security grounds and also in the face of competition with China. Speaking at the Center for Strategic and International Studies think tank in Washington, Raimondo said US manufacturing investments "will put this country on track to produce roughly 20 percent of the world's leading-edge logic chips by the end of the decade."  

NIKKEI ASIA: U.S. AIMS TO MAKE 20% OF WORLD'S LEADING-EDGE CHIPS BY 2030: RAIMONDO  

The U.S. will manufacture a fifth of the world's most advanced logic chips by 2030, backed by a domestic supply chain spanning raw materials to packaging, Commerce Secretary Gina Raimondo announced Monday. Speaking at the Center for Strategic and International Studies think tank here, Raimondo said the U.S. will not be able to lead the world if it depends on a couple of Asian countries for the most advanced chips, especially as artificial intelligence becomes the defining technology of the generation. She explained that the CHIPS and Science Act of 2022, which includes $39 billion in incentives for manufacturing semiconductor devices in the U.S., will help alter the landscape. "We think our investments in leading-edge logic chips, leading-edge logic chip manufacturing, will put this country on track to produce roughly 20% of the world's leading-edge logic chips by the end of the decade," she said. "Today we are at zero," she said. Raimondo also said the Biden administration believes that it will be successful in onshoring production of cost-competitive leading-edge memory chips "at scale" in the U.S. 

Tags CHIPS for America

  U.S. Department of Commerce

 1 day 7 hours ago

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Remarks by U.S. Secretary of Commerce Gina Raimondo: Investing in Leading-Edge Technology: An Update on CHIPS Act Implementation
Remarks by U.S. Secretary of Commerce Gina Raimondo: Investing in Leading-Edge Technology: An Update on CHIPS Act Implementation KCPullen@doc.gov Mon, 02/26/2024 - 15:17 Artificial Intelligence Manufacturing AS PREPARED FOR DELIVERY Monday, February 26, 2024 Office of Public Affairs publicaffairs@doc.gov Gina M. Raimondo

Thank you to the Center for Strategic and International Studies for hosting us.

Last February, the Commerce Department rolled out the funding applications for the CHIPS for America program. I said at the time that our effort mirrors the space race – and I meant it.

President Kennedy’s historic call to put a man on the Moon spurred an unprecedented effort by the government, private sector, and academia to secure America’s place at the frontier of innovation.

Now six decades later, President Biden is calling us to unite around a common purpose so that we can once again cement our role as the global technological leader in this industry.

We all know our modern world is powered by semiconductors. From windshield wipers to cell phones to pacemakers to rocket ships, chips are fundamental to every aspect of our lives and our economy. And now, on top of all of this, AI has emerged as a game changer, driving unbelievable demand for leading-edge chips.

The term “Generative AI” wasn’t even part of our vocabulary when Congress was debating the CHIPS and Science Act. Now, it’s everywhere. It takes tens of thousands of leading-edge chips to train one frontier AI model.

U.S. companies lead the world in driving AI forward, dominating the design of AI chips and the development of Large Language Models. But we don’t manufacture or package any of the leading-edge AI chips needed to fuel the innovation ecosystem and power our most critical defense systems.  

We cannot build the next generation of technological leadership on such a shaky foundation. We need more talent development, R&D, and manufacturing to take place in America.

Meanwhile, other countries like China aren’t shy about their ambitions and are taking an increasingly aggressive approach to their chip production.

If we want to continue to lead in AI and other central technologies, then we must successfully implement this CHIPS initiative and make sure we are being bold enough with our vision.

When we rolled out the program a year ago, I said we would be judged on two things. First, whether we’re able to build a reliable and resilient semiconductor industry that advances America's technological leadership; and second, whether we are good stewards of taxpayer dollars. A year into it, I want to report that we are on track to accomplish both.

In record time, the Commerce Department has stood up a program that is flexible, fast, and world-class.

We’ve built a remarkable team of more than 200 people who represent decades of experience across government, academia, and industry with investment backgrounds, technical and policy expertise, and a track record of delivering on big projects.

The early results are incredible. Since President Biden signed the CHIPS Act – and before we announced a single penny in funding – private companies announced almost $200 billion in semiconductor manufacturing investments. I want to thank industry for the way it’s responded with a willingness to partner with us to achieve our national security goals.

At least nine states have created new economic development programs targeted to the semiconductor industry to provide matching funding and further leverage the law.

And more than 50 community colleges across 19 states have announced new or expanded programming to support semiconductor industry opportunities. We are partnering with labor leaders and manufacturers on training workers to build the pipelines we need to operate new semiconductor fabs and meet our workforce goals. That means sitting down with teacher unions around the country to ensure that high school students have access to good-paying jobs with strong career pathways. 

At the same time, we worked with academia, labor, government research agencies, entrepreneurs, and industry to stand-up the National Semiconductor Technology Center, which will tackle the R&D challenges facing America’s chips manufacturing ecosystem and scale up the robust, skilled workforce needed to power it. And a week ago announced Deirdre Hanford, a recognized industry veteran, as the CEO of that effort.

That’s the good news.

The bad news is that we’ve received over 600 statements of interest and the reality is that a significant majority of those who are expressing interest are not going to receive funding – including many strong proposals by excellent companies. I’ve also said many times that the point of this program was never to provide the semiconductor industry with every dollar it requests; it is to make targeted investments for our national security objectives.

At the outset, we said that we expected to invest about $28 billion of the program’s $39 billion in incentives for leading-edge chip manufacturing. But leading-edge companies alone have requested more than $70 billion, meaning we’re having many tough conversations.

We are engaging industry in a spirit of collaboration, but we are relentlessly focused on safeguarding taxpayer dollars. Our tough negotiations with individual companies will result in each of them doing more for economic and national security at a lower cost to the taxpayer. This means they’re delivering thousands of high-paying jobs for the communities where they are situated and enhancing our national security through their work and their adherence to the national security restrictions associated with CHIPS grants.

And because we’ve pushed companies to do more for less, we’re going to be able to fund dozens more projects to meet our national and economic security needs.

My conversation with every CEO goes roughly as follows: They come in asking for billions of dollars. I look at them across the table and say, ‘you’ll be lucky if you get half of that.’ And when they come in the next time and learn they’re getting less than half of that, they all tell me ‘Secretary, I’m not feeling so lucky.’

The reality is that we have a finite amount of funding to roll out and urgent national security goals to achieve. So, we have to make every dollar count.

We have decided to prioritize projects that will be operational by 2030. There are worthy proposals with plans to come online after 2030 that we say no to in order to maximize our impact in this decade.

None of this work is easy. Many point out that the investments are risky. I agree – of course there’s risk. But there is greater risk if we continue down the course we were on before the President had the courage to fight for these investments as part of his Investing in America agenda. We cannot overly rely on one part of the world for the single most important piece of hardware in the 21st century. That’s far more dangerous. 

Last year, I said the goal was for the U.S. to have at least two new large-scale clusters of leading-edge logic fabs, built by high-skilled labor, with each cluster employing thousands of workers in well-paying jobs. 

Now, I’m pleased to say that we expect our investments to exceed that target. We anticipate that our investments in leading-edge logic chip manufacturing will put us on track to produce roughly 20% of the world’s leading-edge logic chips by 2030, up from the zero percent we produce today.

I want to emphasize this point. We anticipate that America will produce 20% of the world’s leading-edge logic chips by the end of the decade, meaning our manufacturing capacity and supply chains will no longer be as vulnerable to geopolitical challenges as they are today.

In addition to leading-edge logic, leading-edge memory is a critical input for AI systems. Our objective is to onshore cost-competitive leading-edge memory at scale here in the U.S.

In fact, I believe the U.S. can be home to the entire silicon supply chain for the production of leading-edge chips – from polysilicon production to wafer manufacturing to fabrication to advanced packaging.

We also cannot lose sight of the importance of current generation and mature node chips, which are essential to cars, defense systems, medical devices, and critical infrastructure. The pandemic laid bare the fragility of these supply chains. To date, we’ve announced three investments in current and mature chip companies – BAE, Microchip, and Global Foundries. We expect to continue to announce additional investments in current mature production to provide a reliable, domestic source of these critical chips.

I’ll close with this:  If CHIPS for America is successful – as I believe it will be – by the end of the decade, the United States will be the only country in the world where new chip architectures can be invented in our new research labs, designed for every end-use application, manufactured at scale by well-paid American workers, and packaged with the most advanced technologies on our shores.

We have already caught the attention of the world, and the excitement for this program has been palpable. CEOs, governors, unions, and colleges are all stepping up to ask how they can be part of our efforts to revitalize America’s chip ecosystem. Just five or ten years ago, the conversation was “where in Asia do we expand.” Now, companies are saying they want to build and manufacture right here in America.

We’re making tremendous progress in implementing President Biden’s vision of a strong and vibrant American manufacturing sector, and I’m more optimistic than ever. We are moving fast, but much more importantly, we are focused on getting it right and relentlessly pursuing our national security goals.  Together, we are rebuilding our industrial base, supercharging American innovation, creating hundreds of thousands of good-paying jobs, and meeting the monumental challenges of our time.

I’m honored to be doing this work and excited for the announcements in the weeks and months ahead.

Thank you.

Leadership Gina M. Raimondo Tags Secretary Gina Raimondo National Security CHIPS and Science Act CHIPS for America

  U.S. Department of Commerce

 2 days 5 hours ago

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U.S. Secretary of Commerce Gina Raimondo to Lead President’s Export Council Trip to Thailand 
U.S. Secretary of Commerce Gina Raimondo to Lead President’s Export Council Trip to Thailand  ASowah@doc.gov Thu, 02/22/2024 - 20:15 Export and investment promotion FOR IMMEDIATE RELEASE Thursday, February 22, 2024 Office of Public Affairs publicaffairs@doc.gov

U.S. Secretary of Commerce Gina Raimondo will lead members of the President’s Export Council (PEC) to Bangkok, Thailand from March 13 to March 14, 2024, to identify opportunities for the United States and Thailand to strengthen economic relationships across a number of critical issues, including manufacturing, supply chain resiliency, artificial intelligence, and clean technology. Raimondo participated in a PEC meeting in Washington, DC in November 2023, where she announced her intention to lead a fact-finding trip with PEC members to the Indo-Pacific, as well as plans to re-establish the President’s Export Council Subcommittee on Export Administration (PECSEA), which has since been formally launched.

In addition to bilateral meetings and engagements with stakeholders, while in Bangkok, Raimondo will participate in a hybrid Indo-Pacific Economic Framework for Prosperity (IPEF) Ministerial with IPEF partners. The IPEF Ministerial will be the first since the substantial conclusion of negotiations for the proposed IPEF Clean Economy Agreement, Fair Economy Agreement, and overarching Agreement on IPEF, as well as the signing ceremony for the IPEF Supply Chain Agreement in November of 2023.

Raimondo’s travel to Bangkok will follow her leading a Presidential Trade and Investment Mission to Manila, Philippines, from March 11 to March 12, 2024, on behalf of President Biden.

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  U.S. Department of Commerce

 6 days ago

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Readout of Secretary Raimondo’s Call with Republic of Korea Minister of Trade Cheong In-kyo
Readout of Secretary Raimondo’s Call with Republic of Korea Minister of Trade Cheong In-kyo ASowah@doc.gov Wed, 02/21/2024 - 20:20 Export and investment promotion FOR IMMEDIATE RELEASE Wednesday, February 21, 2024 Office of Public Affairs publicaffairs@doc.gov

Today, Secretary of Commerce Gina Raimondo spoke with the Republic of Korea Minister of Trade Cheong In-kyo. The Secretary congratulated Minister Cheong on his appointment as Minister of Trade for the Ministry of Trade, Industry and Energy. The two discussed the strong cooperation between the United States and the Republic of Korea, including through the Indo-Pacific Economic Framework for Prosperity (IPEF). In particular, the Secretary and Minister discussed the importance of maintaining the momentum following the outcomes announced at the IPEF ministerial meeting in San Francisco in November 2023 and the importance of delivering concrete benefits to the IPEF partners’ economies from the economic cooperation under the Framework.

Bureaus and Offices International Trade Administration Tags Indo-Pacific Economic Framework

  U.S. Department of Commerce

 1 week ago

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Readout of Secretary Raimondo’s Meeting with Secretary of State for Science, Innovation and Technology of the United Kingdom Michelle Donelan
Readout of Secretary Raimondo’s Meeting with Secretary of State for Science, Innovation and Technology of the United Kingdom Michelle Donelan ASowah@doc.gov Wed, 02/21/2024 - 11:17 Artificial Intelligence FOR IMMEDIATE RELEASE Wednesday, February 21, 2024 Office of Public Affairs publicaffairs@doc.gov

Yesterday, Secretary of Commerce Gina Raimondo spoke with U.K. Secretary of State for Science, Innovation and Technology Michelle Donelan. Building on the momentum achieved at the 2023 U.K. AI Safety Summit in November, Secretary Raimondo underscored the importance of continued U.S.-U.K. collaboration to address issues at the intersection of artificial intelligence and copyright. Secretary Raimondo also highlighted the recent launch of the U.S. AI Safety Institute, and stated she looks forward to continued partnership with the U.K.’s AI Safety Institute.

  U.S. Department of Commerce

 1 week ago

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NTIA Solicits Comments on Open-Weight AI Models
NTIA Solicits Comments on Open-Weight AI Models ASowah@doc.gov Wed, 02/21/2024 - 09:06 Artificial Intelligence FOR IMMEDIATE RELEASE Wednesday, February 21, 2024 Office of Public Affairs publicaffairs@doc.gov

Today, the Department of Commerce’s National Telecommunications and Information Administration (NTIA) launched a Request for Comment on the risks, benefits and potential policy related to advanced artificial intelligence (AI) models with widely available model weights – the core component of AI systems.  

These “open-weight” models allow developers to build upon and adapt previous work, broadening AI tools’ availability to small companies, researchers, nonprofits, and individuals. This may accelerate the diffusion of AI’s benefits and the pace of AI safety research, but it may also increase the scale and likelihood of harms from advanced models. 

“AI is an accelerator – it has the potential to make people’s existing capabilities better, faster, and stronger. In the right hands, it carries incredible opportunity, but in the wrong hands, it can pose a threat to public safety. That’s why, under President Biden’s leadership and direction, we’re acting quickly and precisely to keep pace with this rapidly evolving technology to ensure safety, while protecting innovation,” said Secretary of Commerce Gina Raimondo. “Today, NTIA is inviting public feedback about how widely available access to model weights may impact our society and our national security. This is an important piece of the President’s Executive Order and an early step toward ensuring safety, security, and trust in these systems.” 

President Biden’s Executive Order on Artificial Intelligence directs NTIA to review the risks and benefits of large AI models with widely available weights and develop policy recommendations to maximize those benefits while mitigating the risks.  

“Open-weight AI models raise important questions around safety challenges, and opportunities for competition and innovation,” said Alan Davidson, Assistant Secretary of Commerce for Communications and Information and NTIA Administrator. “These models can help unleash innovation across communities by making powerful tools accessible, but that same accessibility also poses serious risks. Our Request for Comment will help us chart a policy path to promote both safety and innovation in this important technology.” 

The Executive Order directs NTIA to discuss benefits, risks, and policy choices associated with dual-use foundation models, which are powerful models that can be fine-tuned and used for multiple purposes, with widely available model weights. The Request for Comment asks for public feedback about how making model weights and other model components widely available creates benefits or risks to the broader economy, communities, individuals, and to national security.  

Model weights reflect distillations of knowledge within AI models and govern how those models behave. Using large amounts of data, machine learning algorithms train a model to recognize patterns and learn appropriate responses. As the model learns, the values of its weights adjust over time to reflect its new knowledge. Ultimately, the training process aims to arrive at a set of weights optimized to produce behavior that fits the developer’s goals. If a person has access to a model’s weights, that person does not need to train the model from scratch. Additionally, that person can more easily fine-tune the model or adapt it towards different goals, unlocking new innovations but also potentially removing safeguards. 

The Request for Comment seeks input on a number of issues, including: 

  • The varying levels of openness of AI models;
  • The benefits and risks of making model weights widely available compared to the benefits and risks associated with closed models;
  • Innovation, competition, safety, security, trustworthiness, equity, and national security concerns with making AI model weights more or less open; and
  • The role of the U.S. government in guiding, supporting, or restricting the availability of AI model weights.

Comments are due within 30 days of publication of the Request for Comment in the Federal Register. The responses will help inform a report to the President with NTIA’s findings and policy recommendations.

 

About the National Telecommunications and Information Administration    

The National Telecommunications and Information Administration (NTIA), part of the U.S. Department of Commerce, is the Executive Branch agency that advises the President on telecommunications and information policy issues. NTIA’s programs and policymaking focus largely on expanding broadband Internet access and adoption in America, expanding the use of spectrum by all users, advancing public safety communications, and ensuring that the Internet remains an engine for innovation and economic growth.

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  U.S. Department of Commerce

 1 week ago

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Remarks by Commerce Secretary Gina Raimondo at the GlobalFoundries Announcement
Remarks by Commerce Secretary Gina Raimondo at the GlobalFoundries Announcement KCPullen@doc.gov Tue, 02/20/2024 - 10:12 ICT Supply Chain Manufacturing AS PREPARED FOR DELIVERY Tuesday, February 20, 2024 Office of Public Affairs publicaffairs@doc.gov Gina M. Raimondo

Good afternoon! I’m so excited to be here. This is a big day and we owe so much of it to Leader Schumer, who was the driving force behind the CHIPS and Science Act. Thank you to your leader, Tom Caulfield. Thank you to Governor Hochul, who has been a steadfast ally; Representative Tonko, who has been an advocate for New York; and Lael Brainard, who is joining us from the White House. And finally – I would especially like to recognize the GlobalFoundries employees here today. Thank you for joining us to celebrate this announcement.

President Biden cares deeply about rebuilding American manufacturing. We want to make advanced semiconductors right here in the United States of America, right here in Malta, New York. And that's why the President put his back behind the CHIPS and Science Act.

This once-in-a-generation, $50 billion investment will address our chip shortage head-on, bolster our national and economic security, and secure our position as the global leader in R&D, innovation, and manufacturing for decades to come.

With these critical investments, we are ushering in a new era of American manufacturing. America invented semiconductors. Silicon Valley is called Silicon Valley because we invented the semiconductor industry. We once led the world in manufacturing chips, but we watched it leave our shores over a period of decades.

Now, we’re coming back. Today we’re announcing a preliminary memorandum of terms with GlobalFoundries for $1.5 billion in direct CHIPS funding – the largest announcement to date. Through this proposed investment, GlobalFoundries would be able to support a new state-of-the-art facility, significant capacity expansion, and facility modernization at their manufacturing sites in New York and Vermont, all while creating over 10,000 construction and manufacturing jobs over the next decade. Their new state-of-the-art Fab will be the first new foundry built to support current and mature technologies in decades, securing a stable, resilient supply of chips for the U.S. auto and defense industries.

This proposed investment would also allow GlobalFoundries to bring the manufacturing of its 22FDX chips to the U.S. for the first time ever. 22FDX chips are used in everything from auto safety systems to smart mobile devices, and their durability makes them especially important for satellites and other critical defense uses. By making 22FDX chips here, the Department of Defense will have access to GlobalFoundries’ advanced 22 nanometer technology, which hasn’t been possible until now. The DOD would have a steady, secure, domestic supply of these important chips coming from our shores, made by YOU in this room today.

The CHIPS and Science Act is protecting our economic and national security – and YOU are a part of that story. This is only our third CHIPS announcement, with more to come. With this announcement, we’re sending a clear signal to the world that we are serious about bolstering our economic and national security, rebuilding America’s manufacturing industry, and leading the world in technology and innovation. Thank you.

Leadership Gina M. Raimondo Tags Secretary Gina Raimondo CHIPS and Science Act CHIPS for America National Security

  U.S. Department of Commerce

 1 week 1 day ago

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Biden-Harris Administration Announces Preliminary Terms with GlobalFoundries to Strengthen Domestic Legacy Chip Supply for U.S. Auto and Defense Industries
Biden-Harris Administration Announces Preliminary Terms with GlobalFoundries to Strengthen Domestic Legacy Chip Supply for U.S. Auto and Defense Industries ASowah@doc.gov Mon, 02/19/2024 - 05:00 FOR IMMEDIATE RELEASE Monday, February 19, 2024 Office of Public Affairs publicaffairs@doc.gov

U.S. Department of Commerce Outlines $1.5 Billion in Potential Funding to Support Multiple Projects in New York and Vermont and Create Approximately 10,500 Construction and Manufacturing Jobs

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and GlobalFoundries (GF) have signed a non-binding preliminary memorandum of terms (PMT) to provide approximately $1.5 billion in direct funding under the CHIPS and Science Act to strengthen U.S. domestic supply chain resilience, bolster U.S. competitiveness in current-generation and mature-node (C&M) semiconductor production, and support economic and national security capabilities. The proposed funding would support a new state-of-the-art facility, significant capacity expansion, and the modernization of GF’s U.S. manufacturing sites in New York and Vermont, which produce essential automotive, communications, and defense semiconductor technologies.  

President Biden signed the bipartisan CHIPS and Science Act to strengthen U.S. supply chains, create good-paying jobs, and advance U.S. economic and national security. Today’s announcement is the third PMT announcement the Department of Commerce has made under the CHIPS and Science Act.  

GF chips are fundamental to everyday applications that impact all Americans, from blind spot detection and collision warnings in cars, to smartphones and electric vehicles that last longer between charges, to secure and reliable Wi-Fi and cellular connections. Currently, there are only four companies outside of China that provide current and mature foundry capabilities at the scale of GF – and GF is the only one of those companies that is headquartered in the United States. Shortages of some of these semiconductors caused major disruptions during the COVID-19 pandemic, resulting in a particularly acute impact on the availability and price of a broad range of goods for Americans, as well as the shutdown of automobile manufacturing sites. Part of the proposed funding is expected to support expanding the facility that houses a dedicated capacity corridor for General Motors, with whom GF entered into a strategic long-term supply agreement last year.   

“Semiconductors are the brain of modern technology. While they are no larger than a fingernail and no thicker than a piece of paper, they are essential to every electronic device that we currently use – from computers and televisions to cars and washing machines. Thanks to our Administration’s CHIPS and Science Act, we are announcing the Department of Commerce’s preliminary agreement with GlobalFoundries, which will award approximately $1.5 billion to expand domestic production of semiconductors, strengthen U.S. supply chains, and create thousands of good paying jobs right here in America,” said Vice President Kamala Harris. “President Biden and I continue to be fully committed to growing our economy and creating opportunity in every part of America. Today’s announcement is another way in which we are delivering on that commitment in New York, Vermont, and communities throughout the country.” 

“Semiconductors are in everything from our cellphones, to refrigerators, to cars, and our most advanced weapons systems, and access to them carries important economic and national security implications. It was the shortages of semiconductors during the COVID-19 pandemic that raised prices for consumers and led to the shutdown of automobile manufacturing sites across the country,” said Secretary of Commerce Gina Raimondo. “Thanks to President Biden’s CHIPS and Science Act, we’re working to onshore these critical technologies in order to bolster the supply of domestic chips that are essential to manufacturing cars, electronics, and national defense systems in New York, Vermont, and states across the country.” 

“The CHIPS and Science Act set out to make the United States a leader in semiconductor R&D and manufacturing, and with this proposed CHIPS funding, GlobalFoundries could help realize this vision by modernizing and building new chip fabrication facilities to increase its capacity to make current-generation and mature-node chips in the United States while creating thousands of good jobs in New York and Vermont,” said Under Secretary of Commerce for Standards and Technology and NIST Director Laurie E. Locascio. “By investing in domestic manufacturing capabilities, CHIPS for America is helping secure a stable domestic supply of chips that are found in everything from home electronics to advanced aerospace systems.” 

"GF is proud to announce this proposed funding from the Department of Commerce and appreciates the collaboration of the CHIPS Office throughout this process. These proposed investments, along with the investment tax credit (ITC) for semiconductor manufacturing, are central to the next chapter of the GlobalFoundries story and our industry. They would also play an important role in making the U.S. semiconductor ecosystem more globally competitive and resilient," said Dr. Thomas Caulfield, president and CEO of GF. "With new onshore capacity and technology on the horizon, as an industry we now need to turn our attention to increasing the demand for U.S.-made chips, and to growing our talented U.S. semiconductor workforce." 

The proposed expansion of GF is expected to help advance U.S. economic and national security by increasing capacity, strengthening supply chain resilience, and onshoring technologies in the U.S. for the first time that are important to our defense and intelligence communities. With multiple facilities that are designated as Trusted Foundries by the Department of Defense, GF has a long history of supporting the U.S. military and this proposed funding is expected to strengthen those ties. The Department of Defense relies on GF chips for national defense uses including satellite and space communications. GF chips also support broader U.S. technological leadership and discovery, such as the James Webb Telescope and the International Space Station.  

The approximately $1.5 billion in proposed CHIPS funding would be split across three projects:  

  • Malta, New York – New State-of-the-Art 300 mm Fab: The construction of a new, large-scale 300 mm fabrication facility that is expected to produce high value technologies not currently available in the U.S. The new facility is intended to leverage existing infrastructure to expedite the path from construction to production. 
  • Malta, New York – Capacity Expansion for Automotive: The proposed expansion of the existing Malta, New York fabrication facility, which includes a strategic agreement with General Motors, to secure a dedicated supply of essential semiconductor technologies. This project would also support America’s economic and national security by expanding domestic capacity for semiconductors that are used in the U.S. critical infrastructure base. This expansion, combined with the new 300 mm fabrication facility, is expected to triple the existing capacity of the Malta campus over the next 10+ years. These two projects are expected to increase wafer production to 1 million per year once all phases are complete. 
  • Burlington, Vermont – Fab Revitalization: The revitalization of an existing fabrication facility in Burlington, Vermont, to commercialize new 200 mm technologies, creating the first U.S. facility capable of high-volume manufacturing of next-generation Gallium Nitride on Silicon for use in electric vehicles, power grid, 5G and 6G smartphones, and other critical technologies. The site will apply industry-leading sustainability practices, including the use of 100% carbon-neutral energy and the development of an onsite solar system to supply up to 9% of the site’s annual energy. 

The proposed projects would create approximately 1,500 manufacturing jobs and approximately 9,000 construction jobs over the next 10 years. The PMT also proposes approximately $10 million in dedicated workforce development funding for GF to work with local workforce, education, training, and community-based organizations to provide GF with the facilities and construction talent they need now and in the future. GF also continues to build upon its GF Maintenance Technician Apprenticeship Program, which is the first U.S. registered semiconductor apprenticeship program and graduated its first apprentices in 2022. In recognizing the critical importance of child care for its operations, the company will not only continue to provide its $1,000 annual subsidy and child care support concierge service to its growing facility workforce but also extend these benefits to its construction workers. The company will be operating under an existing Project Labor Agreement (PLA) in New York and is in the process of establishing a PLA in Vermont for the purposes of this project.  

In addition to potential direct funding, the CHIPS Program Office would make approximately $1.6 billion in loans available to GF under the PMT. The total potential public and private investment for the combined projects would be approximately $12.5 billion.  

As explained in the Department’s first Notice of Funding Opportunity, the Department may offer applicants a PMT on a non-binding basis after satisfactory completion of the merit review of a full application. The PMT outlines key terms for a CHIPS incentives award, including the amount and form of the award. After the PMT is signed, the Department begins a comprehensive due diligence process on the proposed project and other information contained in the application. After satisfactory completion of the due diligence phase, the Department may enter into final award documents with the applicant. Terms of the final award documents are subject to negotiations with the applicant and may differ from the terms of the PMT.  

 

About CHIPS for America  

The Department has received more than 600 statements of interest, more than 160 pre-applications and full applications for NOFO 1, and more than 160 small supplier concept plans for NOFO 2. The Department is continuing to conduct rigorous evaluation of applications to determine which projects will advance U.S. national and economic security, attract more private capital, and deliver other economic benefits to the country. The announcement with GlobalFoundries is the third PMT announcement the Department of Commerce has made under the CHIPS and Science Act, with additional PMT announcements expected to follow throughout 2024.     

CHIPS for America is part of President Biden’s economic plan to invest in America, stimulate private sector investment, create good-paying jobs, make more in the United States, and revitalize communities left behind. CHIPS for America includes the CHIPS Program Office, responsible for manufacturing incentives, and the CHIPS Research and Development Office, responsible for R&D programs, that both sit within the National Institute of Standards and Technology (NIST) at the Department of Commerce. NIST promotes U.S. innovation and industrial competitiveness by advancing measurement science, standards, and technology in ways that enhance economic security and improve our quality of life. NIST is uniquely positioned to successfully administer the CHIPS for America program because of the bureau’s strong relationships with U.S. industries, its deep understanding of the semiconductor ecosystem, and its reputation as fair and trusted. Visit www.chips.gov to learn more.  

GlobalFoundries Contacts

GlobalFoundries Media Relations: Erica McGill at erica.mcgill@gf.com
GlobalFoundries NY Community Contact: Julie Moynehan at julie.moynehan@gf.com
GlobalFoundries VT Community Contact: Gina DeRossi at gina.derossi@gf.com

Bureaus and Offices National Institute of Standards and Technology Tags CHIPS for America

  U.S. Department of Commerce

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Readout of Secretary Raimondo’s Meeting with Australian Minister for Trade and Tourism Don Farrell
Readout of Secretary Raimondo’s Meeting with Australian Minister for Trade and Tourism Don Farrell ASowah@doc.gov Wed, 02/14/2024 - 19:16 Export and investment promotion FOR IMMEDIATE RELEASE Wednesday, February 14, 2024 Office of Public Affairs publicaffairs@doc.gov

Today, Secretary of Commerce Gina Raimondo spoke with Australia’s Minister for Trade and Tourism Don Farrell. During the call, Secretary Raimondo thanked the Minister and the Government of Australia for efforts to strengthen our bilateral trade and investment relationship through the U.S.-Australia Strategic Commercial Dialogue. Secretary Raimondo also conveyed her deep commitment to making the Indo-Pacific Framework for Prosperity (IPEF) an enduring vehicle for deepening economic cooperation and delivering concrete benefits to IPEF partners’ economies. The Secretary and Minister discussed the inaugural IPEF Clean Economy Investor Forum, which the IPEF partners intend to hold during the first half of this year to identify projects that will help advance IPEF member countries’ climate objectives and accelerate their green transitions.

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U.S. Secretary of Commerce Gina Raimondo to Travel to Costa Rica to Highlight Bilateral Commercial Relationship, Underscore Need for Diverse Semiconductor Supply Chains
U.S. Secretary of Commerce Gina Raimondo to Travel to Costa Rica to Highlight Bilateral Commercial Relationship, Underscore Need for Diverse Semiconductor Supply Chains KCPullen@doc.gov Wed, 02/14/2024 - 17:40 Export and investment promotion ICT Supply Chain FOR IMMEDIATE RELEASE Wednesday, February 14, 2024 Office of Public Affairs publicaffairs@doc.gov

U.S. Secretary of Commerce Gina Raimondo will travel to Costa Rica next month to highlight the U.S.-Costa Rican bilateral commercial and investment relationship, and to underscore the need for diverse and resilient semiconductor supply chains. During her travel, the Secretary will address the need for geographical diversification of the semiconductor ecosystem to like-minded nations through meetings with Costa Rican government officials and representatives from the semiconductor industry. Secretary Raimondo will emphasize the strong commercial partnership between the United States and Costa Rica through bilateral engagements with government officials and both U.S. and Costa Rican business leaders.

Leadership Gina M. Raimondo Tags Secretary Gina Raimondo Semiconductor Industry

  U.S. Department of Commerce

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U.S. Department of Commerce Releases 2023 Update to Equity Action Plan, Outlines New Commitments to Advance Equity
U.S. Department of Commerce Releases 2023 Update to Equity Action Plan, Outlines New Commitments to Advance Equity KCPullen@doc.gov Wed, 02/14/2024 - 08:40 Minority business growth FOR IMMEDIATE RELEASE Wednesday, February 14, 2024 Office of Public Affairs publicaffairs@doc.gov

Today the U.S. Department of Commerce released the 2023 update to its Equity Action Plan, in coordination with the Biden-Harris Administration’s whole-of-government equity agenda. This Equity Action Plan is part of the Department’s efforts to implement the President’s Executive Order on “Further Advancing Racial Equity and Support for Underserved Communities Through The Federal Government,” which reaffirmed the Administration’s commitment to deliver equity and build an America in which all can participate, prosper, and reach their full potential.

“Homogeneity is the enemy of innovation. If we are to out-build, out-innovate, and out-compete the rest of the world, we need to ensure we’re harnessing and empowering Americans across the country by utilizing our greatest strength - diversity,” said Secretary of Commerce Gina Raimondo. “That’s why the Biden-Harris Administration’s commitment to equity is so important and why I’m proud to see that reflected in this updated action plan. We fail to meet our full potential as a nation unless we harness the talents and strengths of all parts of the country, including those who have too often been left behind.”

Deputy Secretary of Commerce Don Graves will participate in an event at the White House this morning to outline the updated Equity Action Plan, where he will be accompanied by Donna Ennis, Co-Director of the Georgia Artificial Intelligence in Manufacturing (Georgia AIM), who is a winner of the Build Back Better Regional Challenge (BBBRC). The presentation will highlight  workforce pipelines put in place to ensure all Americans, including people from underserved communities, can participate in the innovation economy.

“Thanks to President Biden’s continued and steadfast commitment to supporting underserved and underrepresented communities, this Administration has made historic progress to achieving equity centered initiatives,” said Deputy Commerce Secretary Don Graves. “Through investments in business grants and funding opportunities, the Secretary and I are proud of the Commerce Department’s efforts in promoting equitable and inclusive capitalism that will pave the path to America’s economic prosperity.”

In alignment with the Department of Commerce’s strategic goals, the Equity Action Plan includes real-life examples of how America’s economy and people are best served by filtering our work through a prism of equity. America’s diversity is its competitive advantage – but only if everyone has an opportunity to fulfill their potential and fully participate in our economy.

The equity strategies associated with each strategic goal will assist in designing programs that will address barriers to equity and meet the needs of all Americans, including underserved communities.

  • Equity Strategy 1: Mobilize our nation’s diversity to fuel innovation and sustain our global competitiveness across geographic regions so that all communities have equal access to opportunities.
  • Equity Strategy 2: Expand growth opportunities for businesses and entrepreneurs, including in underserved communities.
  • Equity Strategy 3: Promote equitable economic development and career pathways to good jobs.
  • Equity Strategy 4: Use targeted investments and program design to address the climate crisis through mitigation, adaptation, and resilience efforts to ensure environmental and economic resilience.
  • Equity Strategy 5: Expand opportunity and discovery through data to inform and evaluate actions that improve community outcomes.

Since the release of its first-ever Equity Action Plan in 2022, the Department of Commerce has:

  • Released $3 billion in American Rescue Plan dollars across 780 awards through six innovative economic development programs.
  • Reduced the cost of bringing high-speed internet to unserved and underserved communities, and increased the resilience of internet infrastructure.
  • Invested $100 million to support the needs of tribal governments and Indigenous communities across 51 awards in 25 states and the Northern Mariana Islands.

Learn more about the Administration’s equity work at whitehouse.gov/equity and check out all Federal Equity Action Plans at performance.gov/equity.

To follow stories and posts across agencies, follow the hashtags #GovEquity and #GovDelivers on social media.

Tags Secretary Gina Raimondo Diversity and Inclusion Diversity, Equity, Inclusion, and Accessibility (DEIA)

  U.S. Department of Commerce

 2 weeks ago

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Remarks by Commerce Secretary Gina Raimondo at the Virginia Innovation Forum
Remarks by Commerce Secretary Gina Raimondo at the Virginia Innovation Forum KCPullen@doc.gov Tue, 02/13/2024 - 13:30 ICT Supply Chain AS PREPARED FOR DELIVERY Tuesday, February 13, 2024 Office of Public Affairs publicaffairs@doc.gov Gina M. Raimondo

Thank you, Senator Warner. I am grateful to you and Representative Beyer for joining us today. Your leadership was essential to getting the CHIPS and Science Act passed and making the Innovation Fund happen.

I also want to thank Assistant Secretary Davidson and the entire Innovation Fund team at NTIA for your terrific work standing up this program and funding projects like the one we’re here to celebrate.

All of us are here for a simple reason: If America is going out-compete the rest of the world, we need to invest in technology and innovation. Wireless technology is particularly critical in that mission for our both our economic and national security.

Today, there are only a handful of wireless equipment suppliers, and some of them pose significant national security risks to the U.S. and our allies. That’s a serious problem – it’s unacceptable.

As is often the case, the solution to our greatest challenges can be found in fundamental American values: openness, competition, and working with our allies. Those are the driving forces behind the Innovation Fund.

By embracing open and interoperable wireless networks, we’re opening the door to innovation, we’re giving our wireless companies more choices, and we’re strengthening our supply chains. It will result in better performance, more secure networks and potentially lower costs for consumers.

As we see with today’s award, embracing competition doesn’t mean we’re rejecting collaboration. The ACCoRD project brings together over two dozen carriers, equipment suppliers, and universities, including our wonderful hosts, Virginia Tech.

I also want to thank the representatives from the Japanese and Indian embassies for joining us in this endeavor. Fortifying supply chains is an international undertaking. We can't do it all alone and need to rely on our allies and partners to help us diversify our supply chains. We need to work together to build our capacity so that we can do the research, train the talent, and build the infrastructure needed to continue our leadership in telecommunications.

As of today, the Innovation Fund has contributed more than $140 million in wireless testing infrastructure and research, a historic investment by the federal government. These investments are laying the foundation for a new generation of prosperity and innovation.

There’s a lot more work to do, but this is an exciting moment, and I can’t wait to see the results of this fantastic collaboration. Thank you.

Bureaus and Offices National Telecommunications and Information Administration Leadership Gina M. Raimondo Tags Secretary Gina Raimondo CHIPS and Science Act National Security

  U.S. Department of Commerce

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Readout of Secretary Raimondo’s Meeting with Singapore Minister of Trade and Industry Gan Kim Yong
Readout of Secretary Raimondo’s Meeting with Singapore Minister of Trade and Industry Gan Kim Yong ASowah@doc.gov Mon, 02/12/2024 - 19:14 Export and investment promotion FOR IMMEDIATE RELEASE Monday, February 12, 2024 Office of Public Affairs publicaffairs@doc.gov

Today, Secretary of Commerce Gina Raimondo spoke with Singapore Minister of Trade and Industry Gan Kim Yong. Secretary Raimondo wished Minister Gan a happy Lunar New Year and thanked him and the Government of Singapore for its strong commitment to the continued success of the Indo-Pacific Economic Framework for Prosperity (IPEF). The Secretary and Minister also discussed work that the United States, Singapore, and the other IPEF partners are undertaking to operationalize the Supply Chain, Clean Economy, and Fair Economy agreements for the benefit of IPEF partners’ economies. The Secretary and Minister also discussed the upcoming IPEF Clean Economy Investor Forum, which the partners intend to hold during the first half of the year to accelerate infrastructure and climate technology projects with the goal of facilitating and capturing the commercial opportunities that will come from IPEF partners’ transitions to clean economies.

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  U.S. Department of Commerce

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Readout of Secretary Raimondo’s Meeting with Deputy Prime Minister of Thailand Parnpree Bahiddha-Nukara
Readout of Secretary Raimondo’s Meeting with Deputy Prime Minister of Thailand Parnpree Bahiddha-Nukara KCPullen@doc.gov Mon, 02/12/2024 - 17:52 ICT Supply Chain FOR IMMEDIATE RELEASE Monday, February 12, 2024 Office of Public Affairs publicaffairs@doc.gov

Today, Secretary of Commerce Gina Raimondo met with Thailand’s Deputy Prime Minister and Minister of Foreign Affairs Parnpree Bahiddha-Nukara. During the meeting, Secretary Raimondo underscored the importance of Thailand’s contributions and participation in the Indo-Pacific Economic Framework for Prosperity (IPEF). In particular, the two discussed ways to work together to strengthen economic ties between the U.S. and Thailand. They also addressed how to best realize the potential of IPEF to deliver concrete benefits to the U.S., Thailand, and other IPEF partners through the long-term economic cooperation envisioned under the IPEF Supply Chain Agreement and the proposed Clean Economy Agreement and Fair Economy Agreement.

Leadership Gina M. Raimondo Tags Secretary Gina Raimondo Indo-Pacific Economic Framework Indo Pacific

  U.S. Department of Commerce

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Two Years of Indo-Pacific Strategic Results: Strengthening Indo-Pacific Commerce for a Prosperous Future
Two Years of Indo-Pacific Strategic Results: Strengthening Indo-Pacific Commerce for a Prosperous Future ASowah@doc.gov Fri, 02/09/2024 - 13:00 FOR IMMEDIATE RELEASE Friday, February 9, 2024 Office of Public Affairs publicaffairs@doc.gov

Under the Biden-Harris Administration’s Indo-Pacific Strategy, launched on February 11, 2022, the United States Department of Commerce has worked collaboratively with allies and partners to build an Indo-Pacific region that is free and open, connected, prosperous, secure, and resilient.

Home to more than one-half of the world’s people and nearly two-thirds of the world’s economy, the Indo-Pacific region stretches from the U.S. Pacific Coast to the Indian Ocean and encompasses Northeast and Southeast Asia, South Asia, and Oceania, including the Pacific Islands. The United States’ vibrant commerce with the Indo-Pacific region supports more than three million U.S. jobs and is the source of nearly $900 billion in foreign direct investment in our domestic economy. The Indo-Pacific will only grow in importance for U.S. prosperity and security as it drives as up to two-thirds of global economic growth.

Over the past 24 months, the Department of Commerce has worked to build prosperity in the region and in the United States through the core lines of effort identified by the Administration in its Indo-Pacific Action Plan. Key accomplishments include:

Driving New Resources to the Indo-Pacific: Since 2022, the Department has added significant new resources to better drive commercial opportunities and bolster supply chain resilience.

  • Field Resources – The Department’s International Trade Administration (ITA) opened a Commercial Service office in Bangladesh and added staffing resources to the Pacific Island nations of Fiji and Papua New Guinea to better serve U.S. companies interested in export opportunities to those markets. ITA added new commercial officers and local staff to better support Indo-Pacific work in Australia, Indonesia, India, Japan, the Philippines, Singapore, South Korea, and Vietnam.
  • Supply Chain Resilience – ITA established a first-of-its-kind Supply Chain Center integrat­ing industry expertise and data analytics to produce innovative supply chain risk assess­ment tools and drive targeted action for critical supply chain resilience.

Leading the Indo-Pacific Economic Framework for Prosperity (IPEF): The Department leads the negotiation and operationalization of three of the four IPEF negotiating pillars, involving 14 IPEF partners (Australia, Brunei Darussalam, Fiji, India, Indonesia, Japan, Republic of Korea, Malaysia, New Zealand, Philippines, Singapore, Thailand, the United States, and Vietnam) and works to support the com­mercial success of U.S. businesses and communities across the IPEF markets.

  • In November 2023, IPEF partners signed a first-of-its-kind IPEF Supply Chain Agreement delivering new tools to prevent supply chain disrup­tions. They also announced substantial conclusion of negotiations for proposed groundbreaking agreements on the Clean Economy, the Fair Economy, and an overarching IPEF Agreement. The first would help capture commercial opportunities from clean economy transitions, and the second seeks to improve business environ­ment transparency and predictability, combat corruption, and enhance taxation transparency and efficiency. These outcomes underscore the viability of this state-of-the-art model for long-term regional economic engagement that will deliver tangible outcomes for the United States and its partners.
  • Our Commercial Strategy – Across the IPEF markets, the Department is aligning with likeminded allies and partners, competing to protect U.S. interests and values, investing in our strengths at home, and addressing complex challenges of the 21st Century global economy—such as supply chain security and resilience, climate change, cybersecurity vulnerabili­ties, artificial intelligence, and economic coercion. We are harnessing more than a dozen senior-level, bilateral commercial dialogues with IPEF partners including Australia, India, Japan, Korea, and Singapore to open markets, align standards, and enhance U.S. company competitiveness.
  • Driving Indo-Pacific Commercial Wins – Since 2022, across the Indo-Pacific region and IPEF markets, ITA has helped 18,998 U.S. companies and facilitated approximately $248.8 billion in U.S. exports and inward investment to the United States that supports 792,000 U.S. jobs.
  • Advancing a Clean Economy – In 2023, ITA executed 154 export promotion programs worldwide to support global deployment of U.S. clean technologies and the Administration’s clean energy goals. Clean Tech Strategic Projects Fund programs were held in Malaysia and Vietnam in 2023, with three more events planned in 2024. A Clean EDGE trade mission will visit India in March, and the 2022 Clean EDGE trade mission to Indonesia, Vietnam, and the Philippines catalyzed millions of dollars in deals on SMRs, biofuels, and fuel cell technology.

Reinforcing Deterrence: The Department’s Bureau of Industry and Security (BIS) has been updating export controls on advanced semiconductor technology, thereby restricting the PRC’s ability to obtain and produce items with military applications, including artificial intelligence. BIS has worked to counter export control evasion to Russia; coordinated bilaterally with the export control authorities of more than a dozen governments, including Japan and South Korea; and engaged partners through regional forums, such as the Southeast Asia Forum on Export Controls and the Asian Export Control Seminar.

Strengthening an Empowered and Unified ASEAN: In cooperation with Singapore, ITA and the Department’s National Institute of Standards and Technology (NIST) have promoted enhanced ASEAN digital standards and cybersecurity that facilitate and secure commercial opportunities across Southeast Asia. The U.S. Patent and Trademark Office (USPTO) continues its work with ASEAN on the administration and civil and criminal enforcement of IP rights. The National Oceanic and Atmospheric Administration (NOAA) broadened international training programs for ASEAN countries to implement the Port State Measures Agreement to deter illegal, unreported, and unregulated fishing.

Supporting India’s Continued Rise and Regional Leadership: Through Commerce Secretary Raimondo’s active work on the U.S.-India Commercial Dialogue and U.S.-India CEO Forum—and with visits by Indian Prime Minister Modi to the United States and by President Biden to India in 2023—the Commerce Department is driving shared action on nearly every aspect of the Indo-Pacific strategy. The Secretary visited New Delhi in March 2023 and has signed MOUs with her Indian counterpart in support of the two countries’ ambitions to elevate and expand their technology partnership through a U.S.-India initiative on Critical and Emerging Technology. These MOUs establish a semiconductor supply chain and innovation partnership and con­nect the two countries’ dynamic startup ecosystems.

Delivering on the Quad: Through the Quadrilateral Security Dialogue between the United States, Australia, India, and Japan, Commerce will continue to strengthen cooperation on critical and emerging technologies and clean energy. These include advancing the five working groups focused on artificial intelligence, semiconduc­tors, clean energy and critical minerals, mobile networks, and quantum information sciences that were established under the Quad Investors Network last year.

Expanding U.S.-Japan-Republic of Korea Cooperation: Our long-time allies and trade partners, Korea and Japan, are cornerstones of the semiconductor, advanced manufacturing, electric vehicle manufacturing, and other hi-tech industries. The three countries seek to hold their first trilateral meeting of Commerce and Industry Ministers in 2024, which will advance the commit­ments made at the Camp David Trilateral Summit last year and strengthen trilateral collaboration in key sectors of tomorrow’s economy.

Partnering to Build Resilience in the Pacific Islands: The Department has expanded engagement in Pacific Island Countries (PIC), including through last year’s announcement that it will lead a U.S. business delegation to the PICs in the coming year, complemented by virtual trade promotion events. Through the work of NOAA, the Department supports the Local2030 Islands Network, which helps com­munities understand and prepare for climate variability and change, along with advanced disaster risk reduc­tion initiatives such as the Weather Ready Pacific, and advanced meteorological training to antici­pate and respond to extreme weather events. Tsunami Ready Programs have equipped Fiji, Marshall Islands, Micronesia, and Palau with critical tsunami resources and decision support tools.

Supporting Good Governance and Accountability: The USPTO organized the first gathering of IPEF partner judiciaries to strengthen legal handling of intel­lectual property litigation, and has organized similar work through APEC, the Oceania Customs Organization, the Asian Development Bank, and through a regional IP Attaché in Bangkok. Support and legal technical assistance from the Department’s Commercial Law Development Program are helping governments across the Indo-Pacific with good governance and bidding rules for clean energy projects; infrastructure procurement improve­ments in Bangladesh, Sri Lanka, the Maldives, the Philippines, and Mongolia; mining governance in Malaysia, Fiji, and Papua New Guinea; and support on data governance, cross-border privacy rules, and technical standards for supply chain security in ASEAN, Sri Lanka, Bangladesh, and the Maldives. The U.S. Census Bureau’s demographic, trade, and geospatial data for the Indo-Pacific Region is informing people and policymakers of essential data, trends, projections, and support to expand capabilities. For instance, the Bureau worked with India’s Ministry of Commerce and Industry to study merchandise trade statistics asymmetries, giving businesses and policymakers a clearer picture of trade trends.

Supporting Open, Resilient, Secure, and Trustworthy Technologies: Work on critical and emerging technologies (CET) is vital for our nation’s security and economic prosper­ity. It ensures that the worldwide digital transformation benefits our economies, societies, and workers. The Department is expanding partnerships on clean technology, defense, energy, and critical infrastructure through CET initiatives with the governments of India, Singapore, Japan, Korea, and Australia, and with companies. We are harnessing inter­na­tional standards to drive artificial intelligence and digital policies that balance safety and security with innovation, competition, and better market access. Our National Telecommuni­cations and Information Administration (NTIA) helped drive Quad agreement on frameworks for 5G and Open RAN supplier diversity, advanced interoperability, security, and deepened industry engagement. The Department’s 2023 cy­bersecurity trade mission to Korea, Japan, and Taiwan ITA has generated significant new cybersecurity commercial agreements for participating U.S. companies.

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  U.S. Department of Commerce

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Remarks by Commerce Secretary Gina Raimondo at the HBCU CHIPS Network Launch
Remarks by Commerce Secretary Gina Raimondo at the HBCU CHIPS Network Launch KCPullen@doc.gov Fri, 02/09/2024 - 12:58 ICT Supply Chain Minority business growth AS PREPARED FOR DELIVERY Friday, February 9, 2024 Office of Public Affairs publicaffairs@doc.gov

Thank you for that introduction, Kylie. I am grateful for your leadership as the Chief Opportunity and Inclusion Officer at CHIPS. It’s my honor to welcome you to the Department of Commerce, especially as we observe Black History Month.

It’s hard to overstate how transformative the CHIPS for America program is going to be for communities across the country. Semiconductors have become integral to nearly every part of our daily lives, and they are rapidly expanding the frontiers of technological innovation.

Thanks to President Biden’s leadership, we are investing $50 billion through the CHIPS for America to revitalize America’s domestic semiconductor industry. It’s going to bolster our national security, spur a new generation of American innovation and R&D, make our supply chains more resilient, and create hundreds of thousands of good jobs.

But we need more workers to meet this moment, from engineers and technicians to researchers and fab managers. That means investing in our workforce and diversifying it. It’s the only way we’re going to get the job done. In fact, I’ve called on college and universities to triple the number of graduates in semiconductor-related fields.

Now, we know that government can’t do it alone. We need a whole-of-society approach, with industry, labor, and educational institutions coming with us together to build a skilled, diverse workforce that can construct and then operate these semiconductor fabs as close to on time and on budget as possible.

At the same time, we have to ensure that America stays at the forefront of technological innovation, especially with the rapid evolution of artificial intelligence. It’s crucial for both our national security and our economic security. The good news is that the CHIPS funding also includes $11 billion to advance U.S. leadership in semiconductor R&D.

And it’s why we need you – America’s Historically Black Colleges and Universities – more than ever. You are a key part of meeting our goals. With the launch of the HBCU CHIPS Network – working in conjunction with Georgia Tech – we’re going to help ensure we have the talent and innovation we need while also bridging gaps in access and opportunity for Black Americans, not widening them. I want you to keep thinking about how your HBCUs can work together with private companies to ensure graduates are ready to start working on day one. If you have ideas, talk to my team, because we are all ears. 

CHIPS for America is our chance to tap into our nation’s greatest resources: our unrivaled innovation and our diversity of talent. By doing so, we are going to execute one of the biggest, boldest projects America has ever undertaken. Thank you again for being here today and your willingness to join the HBCU CHIPS Network. This work is important, and we know that your partnership will help ensure that CHIPS for America is a resounding success and bring more Black Americans into our exciting innovation ecosystem. Thank you.

Bureaus and Offices National Institute of Standards and Technology Leadership Gina M. Raimondo Tags Secretary Gina Raimondo CHIPS and Science Act CHIPS for America

  U.S. Department of Commerce

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Remarks by Commerce Secretary Gina Raimondo at the National Semiconductor Technology Center (NSTC) Consortium Signing
Remarks by Commerce Secretary Gina Raimondo at the National Semiconductor Technology Center (NSTC) Consortium Signing KCPullen@doc.gov Fri, 02/09/2024 - 12:48 ICT Supply Chain Manufacturing AS PREPARED FOR DELIVERY Friday, February 9, 2024 Office of Public Affairs publicaffairs@doc.gov Gina M. Raimondo

Thank you to those of you in attendance today. Many of you have given your time and ideas over the last several years to help us design the plan for the National Semiconductor Technology Center and the CHIPS Research & Development Programs. A special thanks to members of the CHIPS Industrial Advisory Committee, chaired by Mike Splinter, who put in a tremendous amount of work since forming in the fall of 2022 through hundreds of meetings with industry and other stakeholders to make recommendations to me and the Department.

It’s hard to believe it’s only been 18 months since President Biden signed the CHIPS and Science Act into law. Even in that short amount of time, we’ve accomplished so much.

On the incentives side, we’re allocating a huge amount of taxpayer money for industry to rebuild American semiconductor manufacturing – that's a lot to be excited about.

As most of you in this room know, CHIPS for America is also investing $11 billion in CHIPS funding that’s focused on R&D. That’s because the success of the CHIPS for America program will be short-lived if we focus only on manufacturing. R&D is how we ensure the sustainability and resilience of our semiconductor industry at home.

Maintaining our global leadership in chip innovation is also crucial to our ability to lead the world in developing AI safely and responsibly. Our national security and our economic security depend on it. We need to be nimble and dynamic so that we can keep pace. We’ll only do that by having a strong R&D ecosystem at home.

That’s where the NSTC – the National Semiconductor Technology Center – comes in. As a public-private partnership, the NSTC will convene government, industry, customers, suppliers, educational institutions, entrepreneurs, and investors to innovate, connect, and solve problems.

We’re incredibly proud that Deirdre Hanford will lead this effort. She is a semiconductor industry leader with 30 years of experience, and at Natcast, will operate the NSTC consortium. I’m also pleased to announce that the Commerce Department expects to invest over $5 billion in this once-in-a-generation program.

The NSTC will also prioritize launching a Workforce Center of Excellence, which will be the definitive, trusted hub for workforce development for semiconductor companies doing business in America. We want the NSTC to be the place where stakeholders work together to solve the industry’s workforce challenges, help accelerate best practices, and strengthen recruitment and training of the next generation of semiconductor researchers, engineers, and technicians.  

This is exciting work that’s going supercharge American innovation, and I’m looking forward to getting the NSTC consortium up and running. It’s my honor to be here with all of you to sign this agreement. Thank you.

Bureaus and Offices National Institute of Standards and Technology Leadership Gina M. Raimondo Tags CHIPS and Science Act Related Content Biden-Harris Administration Launches Next Phase for Over $5 Billion in CHIPS R&D Investments, Including the National Semiconductor Technology Center (NSTC)

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 2 weeks 5 days ago

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FACT SHEET: Biden-⁠Harris Administration Announces Over $5 Billion from the CHIPS and Science Act for Research, Development, and Workforce
FACT SHEET: Biden-⁠Harris Administration Announces Over $5 Billion from the CHIPS and Science Act for Research, Development, and Workforce ASowah@doc.gov Fri, 02/09/2024 - 09:02 FOR IMMEDIATE RELEASE Friday, February 9, 2024 Office of Public Affairs publicaffairs@doc.gov

The Administration expects to invest billions in the National Semiconductor Technology Center (NSTC), now established as a public-private consortium, and other CHIPS Research and Development (R&D) priorities

Today, the Biden-Harris Administration announced it expects to invest over $5 billion in semiconductor-related research, development, and workforce needs, including in the National Semiconductor Technology Center (NSTC), to advance President Biden’s goals of driving R&D in the United States. As part of the implementation of the CHIPS and Science Act and the President’s Investing in America agenda, these investments advance U.S. leadership in semiconductor R&D, cut down on the time and cost of commercializing new technologies, bolster U.S. national security, and connect and support workers in securing good semiconductor jobs.  

Semiconductors were invented in America and serve as the backbone of the modern economy. But today, the United States produces less than 10 percent of global supply and none of the most advanced chips. Similarly, decades ago the U.S. government invested nearly 2% of GDP in R&D. At that time, federally funded initiatives allowed America led the world in innovation – creating life-changing advances in technology like GPS and the internet. In recent years, however, the government investment ratio has fallen below 1 percent. Under President Biden’s Investing in America agenda, the CHIPS and Science Act aims to change that by making a historic investment in U.S. semiconductor manufacturing, research and development (R&D), and the workforce. The CHIPS R&D program includes $11 billion in total funding to advance four programs: the NSTC; the National Advanced Packaging Manufacturing Program (NAPMP); the CHIPS Metrology Program; and the CHIPS Manufacturing USA Institute. The NSTC, as the centerpiece of the CHIPS R&D program, will bring together and support government, industry, labor, customers, suppliers, educational institutions, entrepreneurs, and investors to accelerate the pace of new innovations, lower barriers to participation in semiconductor R&D, and directly address fundamental needs for a skilled, diverse semiconductor workforce. 
 
Today, the White House hosted research and development and workforce convenings with senior Administration leadership, industry, academia, think tanks, state and local government, and labor, where the Biden-Harris Administration announced several milestones that will drive U.S. leadership in cutting-edge semiconductor research and development, including:
 
Building the National Semiconductor Technology Center

  • Planning to invest at least $5 billion in the NSTC, which is now formally established as a Public-Private Consortium by the Secretaries of Commerce, Defense, and Energy, the Director of the National Science Foundation, and Natcast CEO Deirdre Hanford;
  • Announcing NSTC research priorities for 2024, laying the groundwork to ensure the NSTC supports the U.S. in developing the next generation of semiconductor technologies by supporting design, prototyping, and piloting and through ensuring innovators have access to critical capabilities; and
  • Launching the NSTC Community of Interest, a no-cost, pre-membership program for interested stakeholders to provide input into the program offerings and structure of the NSTC.

Investing in the Semiconductor Workforce

  • Planning to invest at least hundreds of millions of dollars in the NSTC’sworkforce efforts, including the creation of a Workforce Center of Excellence with a presence in multiple regions. This work will build on the Administration’s efforts to create equitable training pathways to connect Americans to the good-paying, high quality jobs in critical industries of the future created by the President’s Investing in America Agenda, including work done through the Biden-Harris Administration’s Workforce Hubs and Advanced Manufacturing Sprint. The NSTC will leverage workforce investments made by industry, academia, and other education and workforce partners and its own funding to:
    • Convene stakeholders, facilitating connections between employers and education and training providers, such as community and technical colleges, workforce development boards, and registered apprenticeship programs;
    • Use data to measure the success of existing programs and to guide future investment;
    • Scale up proven education and training programs; and
    • Pilot new efforts, including initiatives to engage underserved communities.
    • Additional activities could include synthesizing semiconductor education and training to form a common baseline education program, launching campaigns to attract new students and workers to the semiconductor industry, developing new training methodologies, and accelerating access to educational resources.
  • Continuing to engage a broad set of stakeholders to guide the stand-up of the NSTC’s workforce activities, with the goal of launching in summer 2024. The NSTC’s workforce activities will engage senior leadership from the National Science Foundation, Department of Defense, Department of Energy, Department of Labor, and Department of Education, among other federal agencies, to ensure the NSTC benefits from expertise across the government, in addition to experts from industry, academia, labor, and workforce training providers.

Investing in Other Key R&D Needs

  • Commerce released a Notice of Intent to invest at least $200 million in a CHIPS Manufacturing USA Institute to create a first-of-its-kind semiconductor manufacturing digital twin institute, which will allow innovators to replicate and experiment with physical manufacturing processes at low cost, helping to significantly reduce U.S. chip development and manufacturing costs, improve development cycle time, and accelerate the adoption of innovation semiconductor manufacturing technologies;
  • Commerce released a Notice of Intent to fund up to $300 million in new R&D activities in advanced packaging of substrates and substrate materials, a key technology for manufacturing semiconductors, to improve all aspects of system performance and support the breadth of new semiconductor applications; and
  • Commerce has awarded over $100 million in funding across 29 projects in the CHIPS Metrology program addressing common needs across the microelectronic industry. Current projects are helping to develop new measurement instruments, measurement methods, and measurement-informed models and simulations for advanced microelectronics design and manufacturing, all of which will help inventors and entrepreneurs more easily scale innovations into commercial products.

    Today’s announcements build on the progress the Administration has already made in advancing research, development, and innovation in the United States through implementation of the CHIPS and Science Act. Last week, the White House and the National Science Foundation announced 10 U.S. regions that are emerging as innovation ecosystems and receiving over $530 million in investment catalyzed by the National Science Foundation’s Regional Innovation Engines program, including to support advanced semiconductor packaging capabilities in Osceola County, Florida. Over the last several months, the Biden-Harris Administration also officially designated a new nonprofit, the National Center for the Advancement of Semiconductor Technology (Natcast), as the operator of the NSTC, and announced the selection of a Board of Directors and a CEO.  And, in the fall of 2023, the Administration announced the designation of 31 Regional Tech Hubs, including hubs in New York, Oregon, Vermont, Texas, and Oklahoma that will specifically focus on spurring and supporting innovation in semiconductor manufacturing.

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Bureaus and Offices National Institute of Standards and Technology Tags CHIPS for America Related Content Biden-Harris Administration Launches Next Phase for Over $5 Billion in CHIPS R&D Investments, Including the National Semiconductor Technology Center (NSTC)

  U.S. Department of Commerce

 2 weeks 5 days ago

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